Ion Milling Systems

RIBE, CAIBE

ICP sources – 14 or 20 cm beam size
Current density up to 4 mA/cm²
Energy range from 100 to 1000 eV

Automatic pumping unit

Dry pump or oil rotary pump
Turbomolecular pump with ceramic or magnetic bearings
Cryogenic pump

Sample holder

Tiltable substrate holder with planetary rotation and water cooling

Manual or automatic load lock

Etch finish detectors

Laser interferometer
SIMS

Applications

M-RAM
Transitional metal treatment
Microneedles and microtips

Coming Soon

We offer Thermal Evaporation or E-Beam Evaporation HV / UHV Systems that are designed & manufactured by Plassys Bestek using high quality material. Some high lights of the system design are as follows.

Box shape chamber with front door or Cylindrical chamber with top lid options
Load lock with substrate treatment (plasma, ion gun, heating, oxidation…)
Up to 6″ standardized single or multiple substrates in one go
Resistive (Joule), electron beam or inductive sources
Various sample holder functions: heating, water cooling, rotation and/or tilt, LN2
Ion gun for sample preparation, etching or assisted deposition (IAD)
Manual, Semi-Automatic & Fully automatic Control Options

Plassys can also design and make systems to suit your requirements for any specific applications. Some of the application of these thin film system are as follows.

Lift-off processes
HMET, PHMET transistors
Ohmic and Schottky contacts on GaN
IR waveguides
Thermal barriers
Magnetic materials for microwave applications
MEMS encapsulation
Josephson circuits

We offer HV / UHV Sputtering Systems designed for Single or Multi Source to achieve various depositions. Plassys makes rugged sputtering systems that are simple in design and easy to operate. Yet, they deliver very high-quality homogeneous films with good consistency, be it an R&D unit or a production environment.

System Highlights

Cylindrical or D Shaped chambers with top lid or front door options
Standard chambers of 350, 400, 450, 600, 900 mm in diameter sizes
Single-wafer load lock or cassette load lock
Rectangular or circular Cathodes for DC, RF & Pulsed DC Sputtering
Sputter up / down sputtering configurations
Clusters for confocal systems & co-sputtering
Reactive and non-reactive sputtering processes
Static or dynamic deposition : planetary and double planetary rotation or oscillation
RF bias on substrates prior to and during deposition
Substrate temperature up to 1000°C
In-situ Coating Thinness Monitoring & Controlling.
High end Vacuum package with precise Gas Flow Controls
Manual, Semi-Automatic & Fully automatic Control Options

Plassys can also design and make systems to suit your requirements for any specific applications. Plassys Sputtering Systems are deployed successfully in certain processes like deposition of,